MICA Freeform is a microscale fabrication process that bridges the gap between traditional micromachining processes, such as microEDM and laser machining, and newer methods, like LIGA—a process developed in Germany that combines lithography, electroplating and molding.
When it comes to printed electronics, the word of the year—indeed of the decade—has been “potential.” The idea of cheap, abundant printed electronics has been around about as long as the idea of “ubiquitous computing” and the “Internet of Things”—the idea that every object around you will contain components that connect it to the vast electronic infrastructure of our work and personal lives. Yet, something happened along the way to realizing this dream. Or, perhaps, something didn’t happen.
When Martha Symko-Davies, solar business manager for the National Renewable Energy Laboratory in Golden, Colo., was searching for companies worthy of U.S. Department of Energy investment a couple of years ago, she was not looking for a research project.
Here’s a riddle: Without touching them, how do you pick up small, delicate parts, such as those with ultrafine finishes or tiny, electronic components sensitive to electrostatic discharge? Answer: With vacuum tweezers.
Imec, an international consortium focused on micro and nano technology, has a large global staff, and that’s a good thing because it has a lot on its plate.
Keeping up with the growing demand for microelectromechanical systems used inside devices such as smartphones will require MEMS makers to make some new fab friends—as in foundries that can fabricate the devices, help drive down costs and speed time to market.
Keigo Fukumoto, representing Fukui Byora Co., Ltd, Fukui, Japan, during the recent ICOMM 2012 gathering at Northwestern University, Evanston, Ill., offered a brief backround about the company and its Cold Heading Technology.
April 13, 2012—With about 150 attendees turning out for the 7th International Conference on MicroManufacturing (ICOMM 2012) held March 12-14 at Northwestern University, Evanston, Ill., conference organizers hailed the balanced attendance from Asia, Europe and North America as a first for the annual gathering.
Stratasys, Eden Prairie, Minn., and Optomec Inc., Albuquerque, N.M., have partnered in a joint development project to merge 3-D printing and printed electronics to create what Stratasys is calling the first fully printed hybrid structure, according to a release by Stratasys.
Feb. 20, 2012—The University of New South Wales (UNSW), Sydney, Australia, today announced that researchers at the university's ARC Center for Quantum Computation and Communication Technology successfully created a working transistor the size of one atom.
"Micromachining Techniques for Fabrication of Micro and Nano Structures," a new book presenting advances in micromanufacturing technology, is available as a free download through InTech, an open access publisher of scholoarly papers and books.
Feb. 21, 2012—Pixelligent LLC and Brewer Science Inc. have combined their respective expertise in nanocrystal additives and microelectronics "to create a next generation spin-on hardmask for advanced lithography," Brewer announced in a recent news release.
With the stated aim of democratizing manufacturing, MakerBot Industries LLC, Brooklyn, N.Y., heralds its Replicator personal 3-D printer as just the machine for the job. And at less than $2,000, the printer certainly fits right in with the price range of personal computers.
Nov. 4, 2011—Micrel Inc., San Jose, Calif., opened the doors to a new MEMS (microelectromechanical systems) manufacturing facility at its San Jose-based wafer and foundry operations.
The ability to continuously etch precision metal components reel to reel enables Interplex Etch Logic, LLC, Attleboro, Mass., to offer down-stream operations such as forming, plating, molding and automatic assembly.