Hard and brittle materials, like certain types of glass and sapphire, are difficult to process—even for lasers. Poor absorption at most wavelengths combined with poor heat-transfer properties make it difficult or impossible to realize structures in these materials.
The laser world descends each year on the Photonics West conference and exhibition. The event is hosted by SPIE, an international society devoted to advancing biophotonics, biomedical optics, industrial lasers, optoelectronics, microfabrication and green photonics.
Lasers offer a flexible, virtually trouble-free way to mark components for identification purposes. As a result, laser marking has gained ground on other parts-marking techniques.
With the increasing need for traceability, marking operations have become essential at all levels of manufacturing. There are many ways to permanently mark parts, each with advantages and limitations, depending on the application.
Carbon-fiber-reinforced polymers are composite materials that offer numerous benefits as workpiece materials. Reaping those benefits, however, requires effort. This is because CFRPs are non-homogeneous, which makes them tough to cut.
Carbon nanotubes represent the ultimate in carbon-fiber toughness. These reinforced polymers—used in the manufacture of Lockheed’s F-35 Lightning II warplane—are several times stronger and more costly than regular carbon fibers.
In the 1964 movie of the same name, the evil Goldfinger spoke fondly of industrial lasers. “You can put a spot on the moon or cut through solid metal with one,” he said to James Bond, strapped to a gold table and about to be laser-beamed in two. Luckily for Bond, the laser wasn’t very efficient. Just look at the spatters of molten metal, the recast on both sides of the beam. Goldfinger would have made a cleaner cut if he’d used an ultrafast-pulse laser (UFPL).
PhotoScribe Technologies offers this brief video demonstrating a complete turn-key marking solution that the company delivered to a customer for marking pharmaceutical tablets. The laser system is designed to mark on the fly as parts pass beneath the laser.
Most people working with lasers today are trying to do something with the light beam, either as the raw beam or, more commonly, modified with optics. Whether it is printing a label on a part, welding a precision joint or repairing a retina, it is important to understand the nature of the laser beam and its performance.
During the 7th International Conference on MicroManufacturing in March, conference co-chairs Jian Cao and Kornel Ehmann, along with a few of their students, provided an overview of their research and work stations at the university's micromanufacturing lab.
Deli Laser Solutions Co. Ltd. specializes in laser micromachining hard, brittle materials, including ceramics, silicon, glass, quartz and sapphire. The company performs cutting, marking, dicing, etching, welding and drilling. Deli Laser Solutions reports that it can laser-drill 50μm holes with smooth sidewalls and no burrs in 1mm-thick materials.
The Fraunhofer Institute for Laser Technology ILT has unveiled its new “bd-2” sensor for thickness measurements. The system can accurately measure foils, rolled strips and other metallic semi-finished products with an accuracy of at least 100nm, within a measurement range of several millimeters, according to the company.
Trotec Laser Inc.'s LWS 780 marking station is a turn-key laser system for industrial marking and labeling. Typical applications include component marking in machine construction and tool construction and in medical technology and electronics.