Micro bump switch contact points

Dec. 10, 2010—E-FAB has the capabilities to produce precision formed micro bumps for miniature switch contacts, IC test socket contacts, and other contact point applications.

With E-FAB’s precision photo chemical machining, and our micro bump forming process, we have the ability to produce precision bumps on various metals and alloys. Are you in need of a special application for bumps or miniature contact points on thin metal parts?

E-FAB can produce precision micro bumps for all types of applications. Micro bumps can be heat treated in order to provide hardened contact points. They can also be gold plated or plated with other types of metals or alloys. Additionally, in addition to precision bump protrusions, if you need micro divots, cavities, depressions, or precision dimples in thin metal parts, E-FAB can do that too.

Contact E-FAB today with your engineering specifications and we can help design it for you.

Pictured above is a close-up view of the .005 inch (0.127 mm) diameter precision formed micro bumps. Micro bumps can be heat treated in order to provide hardened contact points. Contacts can be gold plated or plated with other metals in order to provide long lasting switch contacts.

Contact our engineers with your engineering specifications and we can start manufacturing your precision parts today. E-FAB provides a wealth of engineering support and technical knowledge to help you plan for optimum parts designs.

Contact our engineering and sales team today for micro contacts, micro bumps parts quote.

Pictured above is the actual size (note this is not a thumbnail view) of the formed micro bump socket. With E-FAB’s precision photo chemical machining, photo etching, and micro chemical milling, capabilities we produce precision thin metal parts for a wide variety of technology applications and industries. When it comes to small thin metal parts fabrication or large format etched designs, E-FAB can build it for you.

E-FAB provides products for a diverse group of industries including: military, medical, dental, optical, NASA, PCB industries (rigid, flex, and rigid-flex printed circuit boards), aerospace products, communications, computers, electronic equipment, EMI technologies, hybrid circuits, interconnect assemblies, laser, instrumentation, ordinance, power semiconductor, semiconductors, RFID, RF, microwave antenna, stacked memory arrays, interconnect modules, tactical, weapons systems, and other high tech OEM companies.