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May/Jun 2013  

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Stanford University researchers have developed an all-carbon, thin-film prototype solar cell that they say could reduce the manufacturing costs associated with rigid silicon solar panels.

T-Ink Inc., New York, offers a "thinking ink" technology that reportedly can replace physical switches, wire and sensors with printed components that create circuits without wires, as the company illustrated in a recent video animation of the process used to make an automobile overhead light.

During the 7th International Conference on MicroManufacturing in March, conference co-chairs Jian Cao and Kornel Ehmann, along with a few of their students, provided an overview of their research and work stations at the university's micromanufacturing lab.

During the 7th International Conference on MicroManufacturing in March, conference co-chairs Jian Cao and Kornel Ehmann, along with a few of their students, provided an overview of their research and work stations at the university's micromanufacturing lab.

Small Car at Vienna thumbA 285µm-long racecar has been fabricated in record time via ultrahigh-precision 3-D printing at Vienna University of Technology.

Small Car at Vienna thumbA 285µm-long racecar has been fabricated in record time via ultrahigh-precision 3-D printing at Vienna University of Technology.

Feb. 20, 2012—The University of New South Wales (UNSW), Sydney, Australia, today announced that researchers at the university's ARC Center for Quantum Computation and Communication Technology successfully created a working transistor the size of one atom.

Recently posted to the Applied Materials Blog, this 5-minute video vignette simplifies the terms and concepts of 3-D semiconductor chips. The Applied Materials Blog is global discussion site that encourages those in the industry to share their ideas, actions and products.

Stanford University researchers recently demonstrated a new stretchable, transparent skin-like sensor developed using carbon nanotubes that bend and act as springs, according to a university news release. The flexible sensor "can be stretched to more than twice its original length and bounce back perfectly to its original shape," the researchers reported.

3M and IBM recently announced plans to jointly develop adhesives that can be used to package semiconductors into densely stacked silicon "towers." The companies intend to create a new class of materials, which will make it possible to build commercial microprocessors composed of layers of up to 100 separate chips, according to the an IBM news release.