Back Issues

Mar/Apr 2012  
μTube: Materials
Micromanufacturing lab tour at Northwestern Univ.

During the 7th International Conference on MicroManufacturing in March, conference co-chairs Jian Cao and Kornel Ehmann, along with a few of their students, provided an overview of their research and work stations at the university's micromanufacturing lab.

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Micromanufacturing lab tour at Northwestern Univ.

During the 7th International Conference on MicroManufacturing in March, conference co-chairs Jian Cao and Kornel Ehmann, along with a few of their students, provided an overview of their research and work stations at the university's micromanufacturing lab.

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Racecar sets world speed record

Small Car at Vienna thumbA 285µm-long racecar has been fabricated in record time via ultrahigh-precision 3-D printing at Vienna University of Technology.

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Racecar sets world speed record

Small Car at Vienna thumbA 285µm-long racecar has been fabricated in record time via ultrahigh-precision 3-D printing at Vienna University of Technology.

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Australian researchers produce 'perfect' single-atom transistor

Feb. 20, 2012—The University of New South Wales (UNSW), Sydney, Australia, today announced that researchers at the university's ARC Center for Quantum Computation and Communication Technology successfully created a working transistor the size of one atom.

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Blog simplifies 3-D chip technology

Recently posted to the Applied Materials Blog, this 5-minute video vignette simplifies the terms and concepts of 3-D semiconductor chips. The Applied Materials Blog is global discussion site that encourages those in the industry to share their ideas, actions and products.

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Spray-on nanotube aids skin-like sensor device

Stanford University researchers recently demonstrated a new stretchable, transparent skin-like sensor developed using carbon nanotubes that bend and act as springs, according to a university news release. The flexible sensor "can be stretched to more than twice its original length and bounce back perfectly to its original shape," the researchers reported.

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3M, IBM set sites on new adhesive for 3-D chips

3M and IBM recently announced plans to jointly develop adhesives that can be used to package semiconductors into densely stacked silicon "towers." The companies intend to create a new class of materials, which will make it possible to build commercial microprocessors composed of layers of up to 100 separate chips, according to the an IBM news release.

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3M, IBM set sites on new adhesive for 3-D chips

3M and IBM recently announced plans to jointly develop adhesives that can be used to package semiconductors into densely stacked silicon "towers." The companies intend to create a new class of materials, which will make it possible to build commercial microprocessors composed of layers of up to 100 separate chips, according to the an IBM news release.

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Vanderbilt stamps low-cost nano devices

June 20, 2011—Vanderbilt University engineers have developed a technique for stamping patterns with features as small as one fatty acid molecule onto a special class of nanomaterials, the university reported online.

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